R&D department

Due to recent exponential increase in PCB technology, the exigency of heat dissipation is now one of the most critical factor when developing their design.

Our R&D department studies solutions for Hi-Power and lighting applications, superior dielectric materials and newest technologic solutions with the aim of minimizing size and noise while increasing performances.

• Thermal Simulation software: to study heat dissipation and find the best solution.
• Thermo-camera: to visualize on a real product heat distribution during its functioning