PCBA Qualification

Before releasing a new product, assembled PCB quality can be assessed by qualifying soldering process in all its features: chemicals,solder alloys, thermal profiles, joints resistance.

Our X-ray 2 equipment allow us to check even the hidden parts of soldering like PTH fillings, BGA's balls, QFN junctions and the general SMD condition in a no-destructive way, to put in evidence defects such as macro-cracks,
shorts and voids.

A finer X-Ray analysis can be obtained by a XPlane and CT tomography acquisitions. Thanks to a special tool, the heated stage, put in the instrument chamber (essentially an oven) a thermal profile can be applied to observe
solder alloy behavior.

Via Cross-section the finest joints characteristics can be appreciated and documented in detail.

Optical and Scanning Electron microscopies allow a solder alloy micro-structure characterization and IMC layer composition analysis.

• Visual Inspection: optical microscopy electronic assemblies inspection
• X-Ray Inspection: no destructive PCBA soldering general condition with particular focus on BGA, QFN components and PTH connections
• Micro-section: solder joints detailed analysis, intermetallic compounds (IMC) layer thickness
• Scanning Electron Microscope (SEM)/Energy Dispersive X-Ray Spectroscopy (EDX): solder alloy micro-structure and IMC layers morphological/ compositional analysis
• Pull & Shear equipment: solder joints strength at T=0 and after ageing (ATC, Thermal shock, vibration)
• Total Ionic Contamination (TIC) /Ion Chromatography (IC): cleanliness condition from PCB up to PCBA