The first step to obtain a good product is to be sure that your PCBs meet construction specifications and IPCs requirements: Prevent Digital-lab has all the capabilities to assure this issue always operating according to IPC test methods and evaluating PCB characteristic according to the IPC standards.
PCB resistance to thermal stress is simulated on a solder pot from 3 to 6 times depending on the soldering process to whom PCB will be submitted. Inner layer separation, laminate condition and PCB lay-up are assessed via cross-section.
PCB finishes are verified thanks to X-Ray Fluorescence (dedicated to metallic layers) and UV-Vis Spectroscopy (dedicated to organic solder preservative) techniques: in order to guarantee a good solder joint formation a basic requirement is a proper thickness.
Copper content in HAL finishing can be assessed by DSC analysis, which reads alloy finishing melting temperature; by this test you will be sure that Copper dissolution will not influence your PCB proper wettability increasing HAL melting temperature.
- X-Ray Fluorescence Spectroscopy (XRF): PCB metallic finishes thicknesses (HAL, ENIG, ENEPIG; ImmAg, Imm Tin)
- UV VIS Spectrophotometer: PCB organic finishes thicknesses (OSP)
- Thermal Stress: PCB inner layer and laminates resistance performed on solder pot according to IPC “Solder float test”
- Micro-section: PCB stack-up, inner layer separation checking
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