| CROSS-SECTION |
IPC TM 650 2.1.1 |
| SOLDER FLOAT TEST (thermal stress of PTH/ laminates) 3 samples |
IPC TM 6502.6.8/2.4.13.1 |
| WETTING BALANCE TEST |
IPC J STD 003 |
| X-RAY INSPECTION |
IPC A 610F |
| X-RAY TOMOGRAPHY |
- |
| PULL&STRENGHT |
IEC 62137-11/1-2 |
| X-RAY FLUORESCENCE SPECTROSCOPY (XRF) |
ASTM B568 |
| SCANNING ELECTRON MICROSCOPE (SEM/EDX) |
- |
| FOURIER INFRARED TRANSFORM SPECTROSCOPY (FTIR) |
ASTM E 1252 |
| LEAD SOLDERING ALLOYS by ICP-AES |
Internal methods |
| LF SOLDERING ALLOYS by ICP-AES |
Internal methods |
| TOTAL IONIC CONTAMINATION (TIC) |
IPC-TM-650 par. 2.3.25 |
| ION CROMATOGRAPHY |
IPC-TM 650 PAR.2.3.28 |
| THERMO GRAVIMETRIC ANALYSIS (TGA) --- TD |
IPC TM650 2.4.24.2 |
| DYNAMIC MECHANICAL ANALYSIS (DMA) --- TG |
IPC TM 650 2.4.24C |
| THERMO MECHANICAL ANALYSIS (TMA) --- TTD, TG , CTE |
IPC TM 650 2.4.24.1 |
| DIFFERENTIAL SCANNING CALORIMETRY --- TG |
IPC TM 650 2.4.25C |
| CLIMATIC CHAMBERS |
IPCs or customers spec |
| THERMAL SHOCK TEST |
IPC-SM-785/9701 |
| VIBRATION TEST |
IEC 60068 – 2- 64/-2-27/-2-6 |
| SALTY SPRAY TEST |
ASTM B 117-07A |
| SURFACE INSULATION RESISTANCE (SIR) TEST |
IPC TM 650 2.6.3.3B |
| INSULATION RESITANCE |
ASTM D257-14 |
| BREAKDOWN VOLTAGE |
IPC TM 650 2.5.6.3 |
| INFRARED IMAGING (THERMAL ANALYSIS) |
- |
| SOLDER MASK ABRASION (pencil method) |
IPC TM 650 2.4.27.2A |
| SOLDER MASK ADHESION (tape test) |
IPC TM 650 2.4.1 E |
| HAL FINISHING MELTING POINT by DSC |
Internal method |
| OSP FINISHING THICKNESS by UV-VIS Spectroscopy |
Internal method |
| BOW & TWIST |
IPC TM 650 2.4.22C |
| 3D THERMAL SIMULATION |
- |
| EDUCATION & CONSULTING |
- |
