Before releasing a new product, assembled PCB quality can be assessed by qualifying soldering process in all its features: chemicals,solder alloys, thermal profiles, joints resistance.
Our X-ray 2 equipment allow us to check even the hidden parts of soldering like PTH fillings, BGA's balls, QFN junctions and the general SMD condition in a no-destructive way, to put in evidence defects such as macro-cracks, shorts and voids.
A finer X-Ray analysis can be obtained by a XPlane and CT tomography acquisitions. Thanks to a special tool, the heated stage, put in the instrument chamber (essentially an oven) a thermal profile can be applied to observe solder alloy behavior.
Via Cross-section the finest joints characteristics can be appreciated and documented in detail.